CHIP INDUCTOR

- High self-resonant frequency.
- Multilayer monolithic construction yields high reliability
- Excellent solderability and heat resistance for either wave or reflow soldering.

- Miniature volume.
- No cross coupling between inductors due to low magnetic shield and high reliability.
- No lead, ideal for high density SMT installation, with no directionality.
- Superior solderability and resistance to soldering heat, ldeal for wave or reflow soldering.

- High rated current and low direct-current resistance.
- No cross coupling between inductors due to low magnetic sheild and high reliability.
- No leads, ideal for high density SMT installation with no directionality.
- Superior solderability and resistance to soldering heat, ideal for wave or reflow soldering

  • Under the same size the multilayer chip beads produce higher impedance than plug-in beads.
  • These CBG series have substantial EMI & RFI suppression by simply mounting them onto PCB
  • Suitable EIA standard in shape and dimension of chip beads; Can be mounted automatically by SMT equipments.

- Under the same size the multilayer chip beads produce higher impedance than plug-in beads.

- These CBG series have substantial EMI & RFI suppression by simply mounting them onto PCB
- Suitable EIA standard in shape and dimension of chip beads; Can be mounted automatically by SMT equipments.

- A unique terminal electrode structure ensures ensures permissible current 6.0A (max).
- High impedance and EMI suppression effective over a wide frequency range.
- Suitable reflow and wave soldering.

- CBH series beads exhibit high resistance at low frequency, which makes it stop the reduction of the wave-form
effectively.

- Excellent solderability and high heat resistance for either reflow or wave soldering.
- No leads, ideal for SMT.
- Monotilithic inorganic material construction for high reliability.

- Minature size, suitable for SMT.
- Using terminal electrode structure to restrain the parasitic component effect quite caused by lead.
- High Q value and precise inductance tolerance.
- Execellent in solderability and heat resistance.

- Minature size, suitable for SMT.
- Using terminal electrode structure to restrain the parasitic component effect quite caused by lead.
- Low DC resistance, high current and high inductance.
- Execellent in solderability and heat resistance